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  this is information on a product in full production. june 2014 docid025986 rev 2 1/8 ferd20u60 field effect rectifier datasheet ? production data features ? st proprietary process ? stable leakage current over reverse voltage ? low forward voltage drop ? high frequency operation description this single rectifier is based on a proprietary technology, enabling to achieve the best in class v f /i r trade-off for a given silicon surface. packaged in powerflat? 5x6, this device is intended to be used in rectification and freewheeling operations in switch-mode power supplies. tm: powerflat is a trademark of stmicroelectronics k a a a a k k a a powerflat 5x6 ferd20u60djf table 1. device summary symbol value i f(av) 20 a v rrm 60 v t j (max) +150 c v f (typ) 350 mv www.st.com
characteristics ferd20u60 2/8 docid025986 rev 2 1 characteristics to evaluate the conduction losses use the following equation: p = 0.295 x i f(av) + 0.0105 i f 2 (rms) table 2. absolute ratings (limit ing values, at 25 c, unless otherwise specified anode terminals short-circuited) symbol parameter value unit v rrm repetitive peak reverse voltage 60 v i f(rms) forward rms current 45 a i f(av) average forward current, = 0.5 t c = 115 c 20 a i fsm surge non repetitive forward current t p = 10 ms sinusoidal 180 a t stg storage temperature range -65 to + 175 c t j (1) maximum operating junction temperature 150 c 1. condition to avoid thermal runaway for a diode on its own heatsink dptot dtj < 1 rth(j-a) table 3. thermal resistance symbol parameter value (max) unit r th(j-c) junction to case 2.6 c/w table 4. static electrical characteristics (anode terminals short-circuited) symbol parameter test conditions min. typ. max. unit i r (1) reverse leakage current t j = 25 c v r = v rrm 800 a t j = 125 c 30 70 ma v f (2) forward voltage drop t j = 25 c i f = 10 a 0.380 0.425 v t j = 125 c 0.350 0.400 t j = 25 c i f = 20 a 0.465 0.510 t j = 125 c 0.465 0.505 1. pulse test: t p = 5 ms, < 2% 2. pulse test: t p = 380 s, < 2%
docid025986 rev 2 3/8 ferd20u60 characteristics 8 figure 1. average forward power dissipation versus average forward current figure 2. average forward current versus ambient temperature ( = 0.5) p f(av) (w) 0 2 4 6 8 10 12 14 16 0 2 4 6 8 10 12 14 16 18 20 22 24 26      i (a) f(av) t  =tp/t tp i f(av) (a) 0 5 10 15 20 25 30 35 0 25 50 75 100 125 150 r th(j -a) = r th(j -c) t (c) amb t  =tp/t tp figure 3. relative variation of thermal impedance junction to case versus pulse duration figure 4. reverse leakage current versus reverse voltage applied (typical values) 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.e-04 1.e-03 1.e-02 1.e-01 1.e+00 t p (s) single pulse z th(j-c) /r th(j-c) i r (a) m 1.e-02 1.e-01 1.e+00 1.e+01 1.e+02 0 5 10 15 20 25 30 35 40 45 50 55 60 t j = 125 c t j = 50 c t j = 75 c t j = 100 c v r (v) t j = 25 c figure 5. junction capacitance versus reverse voltage applied (typical values) figure 6. forward voltage drop versus forward current (typical values) c(pf) 100 1000 10000 1 10 100 v r (v) f = 1 mhz v osc = 30 mv rms t j = 25 c i f (a) 0.1 1.0 10.0 100.0 0.00 0.05 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 v f (v) t j = 25 c t j = 125 c t j = 75 c
characteristics ferd20u60 4/8 docid025986 rev 2 figure 7. thermal resistance junction to ambient versus copper surface under tab (typical values) 0 25 50 75 100 125 150 012345678910 r t h ( j - a ) (c/w) s cu (cm2) epoxy printed board fr4, copper thickness = 35 m
docid025986 rev 2 5/8 ferd20u60 package information 8 2 package information ? epoxy meets ul94, v0 ? cooling method: by conduction (c) in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 8. powerflat-8l dimensions (definitions) table 5. powerflat-8l dimensions (values) ref. dimensions millimeters inches min. typ. max. min. typ. max. a 0.80 1.00 0.031 0.039 a1 0.02 0.05 0.001 0.002 a2 0.25 0.010 b 0.30 0.50 0.012 0.020 d 5.20 0.205 d2 4.11 4.31 0.162 0.170 e 1.27 0.050 e 6.15 0.242 e2 3.50 3.70 0.138 0.146 l 0.50 0.80 0.020 0.031 k 1.275 1.575 0.050 0.062 d2 e2 k l b e d e a a1 a2
package information ferd20u60 6/8 docid025986 rev 2 figure 9. footprint (dimensions in mm) 1.27 0.62 0.95 0.98 6.29 4.33 3.86 5.35 4.41
docid025986 rev 2 7/8 ferd20u60 ordering information 8 3 ordering information 4 revision history table 6. ordering information order code marking package weight base qty delivery mode FERD20U60DJF-TR fd20u60 powerflat 5x6 95 mg 3000 tape and reel table 7. document revision history date revision changes 25-mar-2014 1 initial release. 06-jun-2014 2 updated device name.
ferd20u60 8/8 docid025986 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a particular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. st products are not designed or authorized for use in: (a) safety critical applications such as life supporting, active implanted devices or systems with product functional safety requirements; (b) aeronautic applications; (c) automotive applications or environments, and/or (d) aerospace applications or environments. where st products are not designed for such use, the purchaser shall use products at purchaser?s sole risk, even if st has been informed in writing of such usage, unless a product is expressly designated by st as being intended for ?automotive, automotive safety or medical? industry domains according to st product design specifications. products formally escc, qml or jan qualified are deemed suitable for use in aerospace by the corresponding governmental agency. resale of st products with provisions different from the statem ents and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or register ed trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2014 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - swed en - switzerland - united kingdom - united states of america www.st.com


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